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Temperature-dependent micro crack healing process

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Abstract

The crack healing process is studied theoretically on the basis of the extended the Thomson-Obreimoff model. The system free-energy F as a function of the crack lengthl and temperatureT is calculated using the self-consistent Einstein model. It is found that with the temperature increase, the energy barrier becomes lower and even disappears at the “healing” temperatureT=T h. It is demonstrated that the cracklattice trapping in the Obreimoff model is controlled by the free-energy barrier height AF(T). The latter exhibits the universal power-law behavior. On the basis of the results obtained, the crack healing time is evaluated.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Kochi National College of Technology, 200-1 Monobe, Nankoku, 783, Kochi, Japan

    Kazuhiro Kitamura, Igor L. Maksimov & Kazumi Nishioka

  2. Faculty of Applied Physics and Microelectronics, Nizhny Novgorod University, 23 Gagarin Ave., 603000, Nizhny Novgrod, Russia

    Igor L. Maksimov

  3. Department of Optical Science and Technology, University of Tokushima, 2-1 Minamijosanjima, 770, Tokushima, Japan

    Kazumi Nishioka

Authors
  1. Kazuhiro Kitamura
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  2. Igor L. Maksimov
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  3. Kazumi Nishioka
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Kitamura, K., Maksimov, I.L. & Nishioka, K. Temperature-dependent micro crack healing process. Metals and Materials 4, 1219–1222 (1998). https://doi.org/10.1007/BF03025997

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  • DOI: https://doi.org/10.1007/BF03025997

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