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Dynamic response of an anti-plane shear crack in a functionally graded piezoelectric strip

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Abstract

The dynamic response of a cracked functionally graded piezoelectric material (FGPM) under transient anti-plane shear mechanical and in-plane electrical loads is investigated in the present paper. It is assumed that the electroelastic material properties of the FGPM vary smoothly in the form of an exponential function along the thickness of the strip. The analysis is conducted on the basis of the unified (or natural) crack boundary condition which is related to the ellipsoidal crack parameters. By using the Laplace and Fourier transforms, the problem is reduced to the solutions of Fredholm integral equations of the second kind. Numerical results for the stress intensity factor and crack sliding displacement are presented to show the influences of the elliptic crack parameters, the electric field, FGPM gradation, crack length, and electromechanical coupling coefficient.

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Authors and Affiliations

  1. Department of Mechanical Design & Manufacturing, Changwon National University, 9 Sarim-dong, Changwon, 641-773, Kyongnam, Korea

    Soon Man Kwon

  2. Department of Mechanical Engineering, Yonsei University, 120-749, Seoul, Korea

    Kang Yong Lee

Authors
  1. Soon Man Kwon
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  2. Kang Yong Lee
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Correspondence to Kang Yong Lee.

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Kwon, S.M., Lee, K.Y. Dynamic response of an anti-plane shear crack in a functionally graded piezoelectric strip. KSME International Journal 18, 419–431 (2004). https://doi.org/10.1007/BF02996107

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  • DOI: https://doi.org/10.1007/BF02996107

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