Abstract
The present study is concerned with a cooling package system for electronic components such as multichip modules (MCM) which are used in many electronic system. The im of the cooling capacity up to heat flux of 4 W/cm2 was achieved. A heat flux of 4 W/cm2 is about two to three times of the value generally accepted as the limit by forced air cooling together with heat pipes (Kishimoto et al., 1994). The data obtained from the experimental program was used to manifest the deficiency and inaccuracies of multitude of the empirical correlations for various heat transfer modes involved in the computer simulation of the proposed system. The dominant role of the temperature distributions in the system and the related two-phase flow heat transfer have been quantitatively identified and the limit of the computer simulation for such system as proposed in the present study has been advanced.
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Abbreviations
- A :
-
Surface area (m 2)
- Ar :
-
Archimedes number, Ar = [gl e 3(ρ l -ρ u ]/(ν l 2 ρ l
- Bo :
-
Bond number,σ[g(ρ l -ρ g ]/(δw 2
- k :
-
Thermal conductivity (W/m K)
- c p :
-
Specific heat (J/kg K)
- C SF :
-
Constant depending on surface finish and fluid, Eq. A. 1 in Appendix
- d :
-
Inner diameter (m)
- D :
-
Outer diameter of tube (m)
- Exp :
-
Experimental
- Fr :
-
Froude numgber, Fr =ω 2 lθ ρ 1/[gl eu (ρ 1-ρ u )]
- f wave :
-
f wave =1.15/[1−0.63(P/P cr )]3.3, Eq. B.3 in Appendix
- g :
-
Acceleration due to gravity (m/s 2)
- h :
-
Heat transfer coefficient (W/m 2 K)
- h LG :
-
Latent heat of vaporization (J/kg)
- l :
-
Length (m)
- L + :
-
lc/le
- m :
-
[(2h conv /(k fin δ fin /1/2
- M :
-
Molecular weight
- Nu :
-
Nusselt number
- P :
-
Pressure (Pascal)
- Pa :
-
Atmospheric pressure (Pascal)
- P r :
-
P/P cr
- Pr :
-
Prandtl number
- P t :
-
Tube pitch (m)
- Q :
-
Heat transfer rate (W)
- q :
-
Heat flux (W/cm 2)
- r :
-
Radius (m)
- R :
-
Resistance (K/W)
- Ra :
-
Rayleigh number
- Re :
-
Reynolds number
- Re ϕ :
-
Re ϕ =Q/(πdh LG μ l )
- Rp :
-
Roughness parameter
- Sim :
-
Simulation
- T :
-
Temperature (°C)
- TCT :
-
Two-phase closed thermosyphon
- ΔT t :
-
Total temperature difference between hot and cold sections
- u :
-
Velocity (m/s)
- U :
-
Overall heat transfer coefficient (W/m 2 K)
- V :
-
Volume (m 3)
- V + :
-
Dimensionless volume ratio of working fluid,V t /V e
- WF :
-
Working fluid
- air :
-
Surrounding air
- b :
-
Bare tube in the transportation zone
- c :
-
Condenser section or condensation
- conv :
-
Convection
- cr :
-
Critical
- e :
-
Evaporator section or heated zone
- f :
-
Forced
- fil :
-
Filler
- free :
-
Free or natural
- g :
-
vapor
- h :
-
Heater
- i :
-
Inner
- l :
-
Liquid
- lam :
-
Laminar
- max :
-
Maximum
- p :
-
Liquid pool
- pl :
-
Holding plate of evaporator
- s :
-
Saturation
- T :
-
Total
- t :
-
Test tube
- turb :
-
Turbulence
- w :
-
Wall
- ∞:
-
Stream
- s :
-
1.0 for water and 1.7 for other liquids, Eq.A.1 in Appendix
- η:
-
Efficiency
- η T :
-
η T =1-(A T /A f /(1-η f
- δ:
-
Thickness (m)
- μ:
-
Dynamic viscosity (kg/s·m)
- ρ:
-
Density (kg/m 3)
- σ:
-
Surface tension (N/m)
- ψ:
-
Parameter according to the fin shape
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Rhi, S.H., Kim, W.T. & Lee, Y. A cooling system using wickless heat pipes for multichip modules: Experiment and analysis. KSME International Journal 11, 208–220 (1997). https://doi.org/10.1007/BF02944894
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DOI: https://doi.org/10.1007/BF02944894