Skip to main content
Log in

Electrical and thermal conductivity of soft solder at low temperatures

  • Solids
  • Published:
Pramana Aims and scope Submit manuscript

Abstract

The electrical resistivity of soft solder (Pb0.28Sn0.72) has been measured in the temperature range 4.2 K to 300 K. The ‘alloy’ becomes electrically superconducting at a temperature of 6.9 K. Above this, in the entire temperature range, the resistivity could be described, apart from the residual resistivity, by the weighted average of the resistivities of the individual constituents which are derived from the Bloch-Grüneisen relation. The results are in accordance with the phase diagram, which shows a co-existence of two phases in almost the entire range of concentration of the Pb-Sn binary system. It has been shown that the thermal conductivity data on soft solder as well as on Pb0.7Sn0.3, both taken from literature, could be interpreted on the same basis, below and above the ‘superconducting transition temperature’. Recent results on other Pb-Sn systems are discussed in the light of this interpretation.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  • Berman R, Foster E L and Rosenberg H M 1955Br. J. Appl. Phys. 6 181

    Article  ADS  Google Scholar 

  • Berman R and McDonald 1951Proc. R. Soc. A209 368

    ADS  Google Scholar 

  • Chandrasekaran S, Hariharan Y, Radhakrishnan T S and Subramanian V 1979 (to appear inCryogenics)

  • Chuah D G S, Ratnalingam R and Seward R J 1978J. Low. Temp. Phys. 31 153

    Article  ADS  Google Scholar 

  • Dwight E G (ed) 1972American Institute of Physics Handbook (New York: McGraw Hill)

    Google Scholar 

  • Hansen M 1958Constitution of binary alloys (New York: McGraw Hill)

    Google Scholar 

  • Harper C A 1972Handbook of wiring, cabling and interconnecting for electronics (New York: McGraw Hill)

    Google Scholar 

  • Karamargin M C, Reynolds C A, Lipschutz F P and Klemens P G 1972Phys. Rev. B5 2856

    ADS  Google Scholar 

  • McDonald D K C 1956 inHandbuch der Phys. (ed. Flugge) Vol. 14

  • Meaden G T 1965Electrical resistance of metals (New York: Plenum)

    Google Scholar 

  • Mendelssohn K 1964 inProgress in low temperature physics ed. C J Gorter (Amsterdam: North Holland) Vol. 1

    Google Scholar 

  • Mendelssohn K and Olsen J L 1950Proc. Phys. Soc. A63 2

    ADS  Google Scholar 

  • Radhakrishnan T S, Hariharan Y and Janawadkar M P 1979 (to be published)

  • Rosenberg H M 1955Philos. Trans. R. Soc. (London) 247 441

    Article  ADS  Google Scholar 

  • Wilson A H 1953Theory of metals (Cambridge: University Press)

    Google Scholar 

  • White G K 1968Experimental techniques in low temperature physics (Oxford: Clarendon Press)

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

About this article

Cite this article

Hariharan, Y., Janawadkar, M.P. & Radhakrishnan, T.S. Electrical and thermal conductivity of soft solder at low temperatures. Pramana - J. Phys. 13, 117–125 (1979). https://doi.org/10.1007/BF02872130

Download citation

  • Received:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF02872130

Keywords

Navigation