Abstract
Single wafer rapid thermal processing (RTP) can be used for various wafer fabrication steps such as annealing, oxidation and chemical vapor deposition. A key issue in RTP is accurate temperature control, i.e., the wafer temperatures should be rapidly increased while maintaining uniformity of the temperature profile. A closed-loop identification method that suppresses RTP drift effects and maintains a linear operating region during identification tests is proposed. A simple graphical identification method that can be implemented on a field controller for autotuning and a nonlinear least squares method have been investigated. Both methods are tested with RTP equipment based on a design developed by Texas Instruments.
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Cho, W., Edgar, T.F. & Lee, J. Closed-loop identification of wafer temperature dynamics in a rapid thermal process. Korean J. Chem. Eng. 23, 171–175 (2006). https://doi.org/10.1007/BF02705711
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DOI: https://doi.org/10.1007/BF02705711