Abstract
Studies of the formation of intermetallic compounds at some lead-free solder/metallization interfaces are briefly reviewed in this article. SnAgCu/Ni and SnAgCu/Cu interfaces are examined in particular. It has been found that (Cu,Ni)6Sn5 forms at SnAgCu/Ni interfaces until copper is depleted from the solder matrix. This article also contrasts the formation of (Au,Ni)Sn4 and related compounds in PbSn/Ni solder joints and lead-free solder joints.
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Zribi, A., Kinyanjui, R., Borgesen, P. et al. Aspects of the structural evolution of lead-free solder joints. JOM 54, 38–40 (2002). https://doi.org/10.1007/BF02701848
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DOI: https://doi.org/10.1007/BF02701848