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Using CollaMat to measure glue in copper electrolyte

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  • Copper Electrodeposition
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Abstract

The development of the CollaMat glue measuring system started at Norddeutsche Affinerie (NA) in 1986. Since 1989, CollaMat has been used for continuous glue measuring in NA’s copper tankhouse. In addition, the system is used under license worldwide in ten tankhouses. This paper provides an overview of basic CollaMat investigations in the laboratory as well as NA experiences in the production plant.

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References

  1. M. Goffmann and T.L. Jordan, U.S. patent 4,474,649 (2 October 1984).

  2. E. Sauer,Tierische Leime und Gelatine (New York: Springer Verlag, 1958).

    Google Scholar 

  3. S. Krzewska et al., “Electrochemical Determination of Thiourea and Glue in the Industrial Copper Electrolyte,”Metall. Trans., 15B (1984), p. 451.

    CAS  Google Scholar 

  4. T.N. Anderson, R.D. Budd, and R.W. Strachan, “A Rapid Electrochemical Method for Measuring the Concentration of Active Glue in Copper Electrolyte Which Contains Thiourea,”Metall. Trans., 7B (1976), p. 333.

    Google Scholar 

  5. Jiang Chu-Song and Varoujan Baltazar, “Cyclic Voltametry for Monitoring Addition Agent Concentrations in Copper Electrorefing,”EPD CongreŚs 91, ed. D.R. Gaskell (Warrendale, PA:TMS, 1991), pp. 365–386.

    Google Scholar 

  6. Bernd E.Langnerand Peter Stantke, “Effectiveness of Glue in Actual Tankhouse Electrolyte Controlled by the CollaMat® Method,”Productivity and Technology in the Metallurgical Industries (1989), pp. 717–724.

  7. M.B. Saban, J.D. Scott, and R.M. Cassidy, “Collagen Proteins in Electrorefining: Rate Constants for Glue Hydrolysis and Effects of Molar Mass on Glue Activity,”Metall. Trans., 23B (1992), p. 125.

    CAS  Google Scholar 

  8. B. Langner et al.. U.S. patent 4,834,842 (30 May 1989).

  9. B. Langner et al., EuropÄische Patentschrift EP 0 294 001 B1 (31 August 1994).

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Stantke, P. Using CollaMat to measure glue in copper electrolyte. JOM 54, 19–22 (2002). https://doi.org/10.1007/BF02701651

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  • DOI: https://doi.org/10.1007/BF02701651

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