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Room temperature creep of Ti-6AI-4V

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Abstract

Recent investigations have shown both that Ti-6A1-4V does and does not exhibit room temperature creep at low stress. In the present investigation three different microstructures (α β anneal, recrystallization anneal and β anneal) of Ti-6A1-4V were examined under dead weight torsional loading. The loading sequence was forward, reverse and second forward loading. It was concluded that even at a stress level well below the yield stress the alloy exhibits creep in forward loading and increased creep strain in reverse loading and second forward loading. Furthermore the rate of creep at constant stress was different in different microstructures of the alloy; the maximum creep rate occurred with the recrystallization anneal and the minimum creep rate occurred with the β anneal. At the maximum stress in forward loading there appeared to be a change in creep mechanism.

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References

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Authors and Affiliations

  1. School of Engineering and Applied Science, The George Washington University, 20052, Washington, D.C.

    M. A. Imam (Research Scientist and Associate Professor) & C. M. Gilmore (Research Scientist and Associate Professor)

Authors
  1. M. A. Imam
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  2. C. M. Gilmore
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Imam, M.A., Gilmore, C.M. Room temperature creep of Ti-6AI-4V. Metall Trans A 10, 419–425 (1979). https://doi.org/10.1007/BF02697068

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  • DOI: https://doi.org/10.1007/BF02697068

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