Skip to main content
Log in

Creep of udimet 500 during thermal cycling: II. The time to failure

  • Published:
Metallurgical Transactions A Aims and scope Submit manuscript

Abstract

The effect of rapid temperature cycling on the time to failure of Udimet 500 superalloy was investigated. It was found that the time to failure is determined only by the minimum creep rate and not by the thermal history. For this reason the time to failure under thermal cycling conditions is longer than the time to failure calculated from isothermal data.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. N. Nir, D. Eylon, A. Rosen:Met. Trans., 1971, vol. 2, p. 2237.

    CAS  Google Scholar 

  2. D. Eylon, A. Rosen, D. G. Brandon:Met. Trans., 1973, vol. 4, p. 1791.

    Article  CAS  Google Scholar 

  3. A. Rosen, D. G. Brandon, D. Eylon, and N. Nir:The Effect of Rapid Thermal Cycling on the Steady-State Creep Rate, J. E. Dorn Memorial Conference, Cleveland, Ohio, November 1972, (to be published).

  4. D. Eylon, D. G. Brandon, and A. Rosen:Creep of a-Iron During Thermal Cycling, ASTM STP, 1973, p. 520.

  5. D. Eylon, N. Nir, and A. Rosen:J. Phys. E. Sci. Instrum., 1970, vol. 3, p. 592.

    Article  Google Scholar 

  6. J. K. Tien, B. H. Kear, and G. R. Leverant:Acta. Met., 1972, vol. 6, pp. 135–40.

    CAS  Google Scholar 

  7. O. D. Sherby and P. M. Burke:Prog. Mater. Sci., 1967, vol. 13, p. 325.

    Google Scholar 

  8. The Superalloys, C. T. Sims and W. Hagel, eds., John Wiley & Sons, 1972.

  9. R. P. Carrker, J. G. Leschen, and J. D. Lubahn:Trans. AIME, 1949, vol. 180, pp. 149–46.

    Google Scholar 

  10. A. Lawley, S. A. Coll, and R. W. Cahn:Trans. TMS-AIME, 1960, vol. 218, p. 166.

    CAS  Google Scholar 

  11. G. V. Valdimirova, V. A. Likhachev, M. M. Myshlyaev, and S. S. Olevskii:Sov.Phys.-Dokl, 1970, vol. 14, no. 10.

  12. T. Nishihara, S. Taira, K. Tanaka, and M. Ohnami:Proc. of The First Japan Congress on Testing Materials, p. 48, 1958.

  13. R. K. Penny and D. L. Marriott:Design for Creep, McGraw Hill, 1971.

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

About this article

Cite this article

Weiss, I., Rosen, A. & Brandon, D.G. Creep of udimet 500 during thermal cycling: II. The time to failure. Metall Trans A 6, 767–772 (1975). https://doi.org/10.1007/BF02672298

Download citation

  • Received:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF02672298

Keywords

Navigation