Abstract
An automated test apparatus has been developed which, for any specific system of tinplate-fluxsolder, enables a very rapid and reproducible direct measurement of four solder wettability parameters;viz., time for initial wetting, wetting rate, equilibrium wetting force, and time to reach this force. These parameters have been measured to determine the effects of the following tinplate soldering variables: three different mild rosin fluxes, solder temperature and composition, tinplate thickness, tin and alloy coating thickness, surface roughness, tin oxide films deposited electrochemically and by baking, and chrome oxide passivating films. In general, wettability data concur with capillary rise measurements but have the advantage of being obtained more rapidly, of being more sensitive to surface state variables, and of being more reproducible. Of the four measured parameters, wetting rate is most sensitive to tinplate surface state and equilibrium force is the best indicator of solder spread.
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Budrys, R.S., Brick, R.M. Variables affecting the wetting of tinplate by Sn-Pb solders. Metall Trans 2, 103–111 (1971). https://doi.org/10.1007/BF02662643
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DOI: https://doi.org/10.1007/BF02662643