Abstract
The dependence of selectivity on HC1 flow and operating pressure for an 850° C SiH2Cl2/ HC1 based SEG process has been investigated. The polysilicon nuclei density (#/cm2 measured by optical microscope) on large unpatterned areas of deposited SiO2 was used to quantify the selectivity of different process conditions. Three distinct selectivity regimes were identified: (a) a non-selective regime with >106 nuclei/cm2, (b) a pattern dependent regime with <106 nuclei/cm2, and (c) an intrinsically selective regime with <1 nuclei/cm2. The intermediate, pattern dependent, selectivity regime was characterized by a much lower density of silicon nuclei in and around patterned areas where windows of Si are exposed, thus making a loss of selectivity more difficult to detect. This phenomenon is shown to arise from feature scale (<100 micron) lateral fluxes of gas phase species. An intrinsically selective regime suitable for VLSI manufacturing, which avoids the high nuclei density associated with the pattern dependent regime, is identified.
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Fitch, J.T., Denning, D.J. & Beard, D. The pattern dependence of selectivity in low pressure selective epitaxial silicon growth. J. Electron. Mater. 21, 455–462 (1992). https://doi.org/10.1007/BF02660411
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DOI: https://doi.org/10.1007/BF02660411