Abstract
Composite dielectric thin films of various combinations of Al2O3 and TiO2 were deposited by e-beam evaporation and co-sputtering. Composition control and dielectric properties are found to be superior for the co-sputtered films. A composition near 55 mole percent TiO2 gives optimum dielectric properties, dielectric constant of 40 and dissipation near .01.
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References
S. M. Sze,Physics of Semiconductor Devices, p. 496, John Wiley & Sons Inc., (1969).
L. K. H. Van Beek, “Dielectric Behavior of Heterogenous Systems”, p. 69 inProgress in Dielectrics, vol. 7, Ed., J.B. Birks, C.R.C. Press (1967).
K. Kusao and K. Wase, Jpn. J. Appl. Phys.7, 437 (1968).
H. Tervi and M. Kobayashi, Appl. Phys. Lett.32, 666 (1978).
H. Kuster and J. Ebert, Thin Solid Films70, 43 (1980).
C.A.R. Pearce, Brit. J. Appl. Phys.6, 358 (1955).
P.M. Alt, D.B. Dove and W.E. Howard, J. Appl. Phys.53, 5187 (1982).
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Tiku, S.K., Smith, G.C. Thin film Al2O3:TiO2 composite dielectric. J. Electron. Mater. 13, 273–279 (1984). https://doi.org/10.1007/BF02656680
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DOI: https://doi.org/10.1007/BF02656680