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Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper

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Abstract

Solid state intermetallic compound layer growth was examined following ther-mal aging of the 58Bi-42Sn/Cu couple for a temperature range of 55 to 120°C and time periods of from 1 to 400 days. The intermetallic compound layer was comprised of sublayers that included the traditional Cu6Sn5 stoichiometry as well as one or more complex Cu-Sn-Bi chemistries. The number of sublayers increased with aging temperature and time. Time-dependent layer thickness computations based upon the empirical expression, Atn + B, revealed a time exponent, n, that decreased with increasing temperature from a maximum of 0.551 at 70°C to 0.417 at 120°C. The apparent activation energy for growth (at 100 days) was 55± 7 kJ/mol. The Bi-Sn/Cu data, together with that from the other solder/copper systems, suggested that at a given homologous temperature, the quantity of Sn in the solder field determines the intermetallic compound layer thickness as a function of time.

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Authors and Affiliations

  1. Center for Solder Science and Technology, Sandia National Laboratories, 87185, Albuquerque, NM

    P. T. Vianco, A. C. Kilgo & R. Grant

Authors
  1. P. T. Vianco
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  2. A. C. Kilgo
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  3. R. Grant
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Vianco, P.T., Kilgo, A.C. & Grant, R. Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper. J. Electron. Mater. 24, 1493–1505 (1995). https://doi.org/10.1007/BF02655468

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  • DOI: https://doi.org/10.1007/BF02655468

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