Abstract
Fundamental understanding of the relationship among process, microstructure, and mechanical properties is essential to solder alloy design, soldering process development, and joint reliability prediction and optimization. This research focused on the process-structure-property relationship in eutectic Sn-Ag/Cu solder joints. As a Pb-free alternative, eutectic Sn-Ag solder offers enhanced mechanical properties, good wettability on Cu and Cu alloys, and the potential for a broader range of application compared to eutectic Sn-Pb solder. The relationship between soldering process parameters (soldering temperature, reflow time, and cooling rate) and joint microstructure was studied systemati-cally. Microhardness, tensile shear strength, and shear creep strength were measured and the relationship between the joint microstructures and mechani-cal properties was determined. Based on these results, low soldering tempera-tures, fast cooling rates, and short reflow times are suggested for producing joints with the best shear strength, ductility, and creep resistance.
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Yang, W., Felton, L.E. & Messler, R.W. The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints. J. Electron. Mater. 24, 1465–1472 (1995). https://doi.org/10.1007/BF02655465
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DOI: https://doi.org/10.1007/BF02655465