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Chemical vapor deposition kinetics of tungsten from WCl6 onto nickel plate at elevated temperatures

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References

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  3. A.S. Grove:Physics and Technology of Semi-Conductor Devices, John Wiley & Sons, Inc., New York, NY, 1977, ch. 1, pp. 7–36.

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  4. V.G. Levich:Physicochemical Hydrodynamics, Prentice-Hall, Englewood Cliffs, NJ, 1962, ch. 2, pp. 78–108.

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Authors and Affiliations

  1. ERC for Rapidly Solidified Advanced Materials and the Department of Metallurgical Engineering, Chungnam National University, 305-764, Daejeon, Korea

    B. S. Chun (Professor) & C. W. Won (Associate Professor)

  2. Department of Metallurgical Engineering, University of Utah, 84112-1183, Salt Lake City, UT

    H. Y. Sohn (Professor)

Authors
  1. B. S. Chun
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  2. C. W. Won
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  3. H. Y. Sohn
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Chun, B.S., Won, C.W. & Sohn, H.Y. Chemical vapor deposition kinetics of tungsten from WCl6 onto nickel plate at elevated temperatures. Metall Trans B 22, 560–563 (1991). https://doi.org/10.1007/BF02654295

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  • DOI: https://doi.org/10.1007/BF02654295

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