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Oxidation through the zirconia substrates of heteroepitaxial silicon films Grown on yttria-stabilized cubic zirconia

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Abstract

We demonstrate the thermal oxidation of the Si side of the interface in epitaxial Si films grown on yttria-stabilized cubic zirconia, 〈Si〉/〈YSZ〉, to form a dual-layer structure of 〈Si〉 /amorphous SiO2/〈YSZ〉. The SiO2 films are formed in either dry oxygen (at 1100‡C) or in pyrogenic steam (at 925‡C) by the rapid diffusion of oxidizing species through the 425 Μm thick cubic zirconia substrate. For instance, a 0.17 Μm thick SiO2 layer is obtained after 100 min in pyrogenic steam at 925‡C. This relatively easy transport of oxidants is unique to YSZ and other insulators which are also superionic oxygen conductors, and cannot be achieved in other existing Si/insulator systems, such as Si-on-sapphire. The present process eliminates the most

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Golecki, I., Maddox, R.L., Glass, H.L. et al. Oxidation through the zirconia substrates of heteroepitaxial silicon films Grown on yttria-stabilized cubic zirconia. J. Electron. Mater. 14, 531–550 (1985). https://doi.org/10.1007/BF02654023

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