Abstract
In view of the need for a lead-free, drop-in replacement for the widely used 40Pb-60Sn near-eutectic solder (m.p. ~183°C), new Sn-Zn-ln based alloys with substantially the same melting point have been developed. It is shown that the alloying additions of In to the Sn-Zn binary system result in a suppression of the melting point to 175-188°C, and at the same time significantly improve the wetting characteristics. While a relatively active flux may be required for good solderability in air atmosphere, the recent manufacturing trend of using inert atmospheres is likely to allow acceptable manufacturability using less active fluxes in the future.
References
Section 1417, Amendment to the Safe Drinking Water Act, 6- 19-1986.
P.J. Walitsky and F.G. Yost,The Relevance of Current Envi- ronmental Issues to Solder Joints in Microelectronic Applications, Proc. NEPCON West, Anaheim, CA, February 23–27, 1992, (Des Plains, IL: Cahners Exhibition Group), p. 1671.
H. Reid, D. Moynihan, J. Leiberman and B. Bradley,Toxic Lead Reduction Act of 1990, S-2637.
Environmental Protection Agency,Comprehensive Review of Lead in the Environment under TSCA, 56FR 22096-98, May 13, 1991.
M. McCormack, S. Jin, G.W. Kammlott and H.S. Chen,Appl. Phys. Lett. 63, July 5, 1993.
M. McCormack, S. Jin and G.W. Kammlott,IEEE Trans. CHMT (to be published).
M. McCormack and S. Jin,JOM July 1993, p.36.
Binary Alloy Phase Diagrams, 2nd ed., Ed. T.B. Massalski (Materials Park, OH: ASM International, 1991), p. 3417.
J.H. Vincent,Circuit World 19 (3), 1993.
N.F. Lashko and S.V. Lashko-Avakyan,Brazing and Soldering of Metals, (Jerusalem: Israel Program for Scientific Translations, 1961), p.69.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
McCormack, M., Jin, S., Chen, H.S. et al. New lead-free, Sn-Zn-In solder alloys. J. Electron. Mater. 23, 687–690 (1994). https://doi.org/10.1007/BF02653357
Received:
Issue Date:
DOI: https://doi.org/10.1007/BF02653357