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The creep and strain rate sensitivity of a high Pb content solder with comparisons to 60Sn/40Pb solder

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Abstract

Creep plays an important role in the mechanical behavior of solder alloys. This paper presents creep and strain rate sensitivity data for a Pb rich solder (92.5Pb, 2.5Ag, 5Sn-Indalloy 151) and compares it to the behavior of near eutectic 60Sn/40Pb solder. The high Pb alloy is used for exposures to higher temperatures than can be withstood by eutectic Sn/Pb solders. The Pb rich solder tested here is less strain rate sensitive than 60Sn/40Pb. There are also differences in the creep behavior.

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  1. GE R. and D. Center, MeT-139, P.O. Box 8, 12301, Schenectady, N.Y.

    Harvey D. Solomon

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Solomon, H.D. The creep and strain rate sensitivity of a high Pb content solder with comparisons to 60Sn/40Pb solder. J. Electron. Mater. 19, 929–936 (1990). https://doi.org/10.1007/BF02652918

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