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Kinetics of environmental fatigue crack growth in a nickel-copper alloy: Part II. In hydrogen

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Abstract

A systematic matrix of fatigue crack growth rate data in a hydrogen environment has been generated in a nickel-copper alloy and compared with the base line data in the milder oxygen and vacuum environments described in the preceding paper. It is found that crack growth in the hydrogen environment is characterized by high values of the Paris equation exponent and faster crack propagation rates as compared to those in the milder environments. Fractographic examination shows that brittle inter granular separation occurs superimposed on an otherwise ductile crack mode in the hydrogen tests. Quantitative fractographic analysis of the hydrogen affected fracture surfaces indicates that the percentage of intergranular failure (area fraction) is a uniquely related function of the mean stress intensity rather than the maximum stress intensity level of fatigue loading. This dependence is discussed in terms of dislocation sweep-in transport of hydrogen deep into the plastic zone during fatigue cycling.

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Author information

Authors and Affiliations

  1. Rockwell Interna- tional, Science Center, 91360, Thousand Oaks, CA

    R. J. Richards (Senior Staff Associate)

  2. Henry Krumb School of Mines, Columbia University, 10027, New York, N.Y.

    S. Purushothaman (Research Associate) & J. K. Tien (Professor of Metallurgy)

  3. Failure Analysis Associates, 90025, Los Angeles, CA

    J. D. Frandsen

  4. Science Center, Rockwell International, USA

    O. Buck (Group Leader)

Authors
  1. R. J. Richards
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  2. S. Purushothaman
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  3. J. K. Tien
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  4. J. D. Frandsen
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  5. O. Buck
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Additional information

Formerly a Graduate Student at Columbia University

Formerly Senior Staff Associate, Science Center, Rockwell International

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Richards, R.J., Purushothaman, S., Tien, J.K. et al. Kinetics of environmental fatigue crack growth in a nickel-copper alloy: Part II. In hydrogen. Metall Trans A 9, 1107–1111 (1978). https://doi.org/10.1007/BF02652215

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  • DOI: https://doi.org/10.1007/BF02652215

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