Abstract
Silicon oxides deposited by remote plasma-enhanced chemical-vapor deposition (Remote PECVD) can be grown under conditions which produce hydrogen-free SiO2, and under conditions which promote the incorporation of bonded-hydrogen in either SiH or SiOH groups, but generally not in both. In this paper, we investigate the relationship between the deposition conditions leading to OH incorporation, and other post-deposition pathway(s) by which OH can also be incorporated. Two ways by which OH can be incorporated into the oxides are by: (i)intrinsic pathways which are associated with the heterogeneous chemical reactions responsible for film growth; and (ii)extrinsic pathways which refer to incorporation after film deposition stops. The results of our experiments to date show no evidence to support the intrinsic process; all of the infrared (ir) detectable OH is shown to derive from post-deposition or extrinsic sources. We have found two distinct post-deposition sources, one from the deposition chamber ambient during cool-down and one from atmospheric moisture. Each of these sources has a particular spectroscopic signature. We show that OH incorporated from atmospheric moisture occurs as spatially correlated near-neighbor Si-OH groups, whereas OH groups incorporated in the deposition chamber ambient are randomly distributed in the SiO2 host material.
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References
D. W. Hess, J. Vac. Sci. Technol.A2, 244 (1984).
A. C. Adams. Solid State Technol.26, 135 (1983).
S. S. Kim, D. V. Tsu, G. Lucovsky, G. G. Fountain and R. J Markunas, Mat. Res. Soc. Proc.146, 1989.
D. V. Tsu, G. N. Parsons and G. Lucovsky, J. Vac. Sci. Technol.A7, 1115 (1989).
D. V. Tsu and G. Lucovsky, Mat. Res. Soc. Proc.131, 289 (1988).
J. Batey and E. Tierney, J. Appl. Phys.60, 3136 (1986).
D. V. Tsu, and G. Lucovsky. Mat. Res. Soc. Symp.77, 595 (1987).
D. V. Tsu, G. Lucovsky, M. Mantini and S. S. Chao, J. Vac. Sci. Technol.A5, 1998 (1987).
G. N. Parsons, D. V. Tsu, C. Wang and G. Lucovsky, J. Vac. Sci. Technol.A7, 1124 (1989).
J. Theil and D. V. Tsu, unpublished data.
W. A. Pliskin, J. Vac. Sci. Technol.14, 1064 (1977).
W. C. Hamilton and J. A. Ibers, Hydrogen Bonding in Solids (W. A. Benjamin Inc., NY 1968) Ch. 3.
Helmut Knözinger, “Ch. 27: Hydrogen Bonds in Systems of Adsorbed Molecules”, The Hydrogen Bond v III, Schuster, Zundel, and Sandorfy eds. North Holland Publishing Co., New York City, 1976, 1265.
A. Novak.Structure and Bonding. J. D. Dunitz,et al., eds.18. Springer-Verlag, New York, 194 (1974).
R. L. Mozzi and B. E. Warren, J. Appl. Cryst.2, 164 (1969).
D. V. Tsu, B. N. Davidson, and G. Lucovsky, Phys. Rev. B.41, 1795 (1989).
M. D. Newton and G. V. Gibbs, Phys. Chem. Minerals6, 221 (1980).
J. T. Fitch, S. S. Kim, C. H. Bjorkman and G. Lucovsky, J. Electron. Mater. 157,19 (1989).
E. A. Irene and E. Tierney, J. Electrochem. Soc.129, 2594 (1982).
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Theil, J.A., Tsu, D.V. & Lucovsky, G. Reaction pathways and sources of OH groups in low temperature remote PECVD silicon dioxide thin films. J. Electron. Mater. 19, 209–217 (1990). https://doi.org/10.1007/BF02651747
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DOI: https://doi.org/10.1007/BF02651747