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Crystal multiplication in undercooled Cu + 2 Pct Sn alloy

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Abstract

The effects of undercooling (AT) from 10 to 175° on grain structure were observed in a Cu + 2 wt pct Sn alloy, in which grain refinement does not occur at large degrees of under-cooling. Quenching soon after recalescence retained transient grain structures not previ-ously reported in the literature. Crystal multiplication by dendrite fragmentation occur-red when undercooling below the liquidus lay in the range △T = 10 to 70°, and resulted in complete grain refinement in the range △T = 50 to 70°. Fragmentation affected primary, secondary and tertiary dendrite arms during and after recalescence. At △T = 70° a sharp transition occurred to a radiating fan-shaped structure of twin-related grains ori-ginating from a single point of nucleation, with no evidence of fragmentation. It is pro-posed that the transition results from a change in the free dendritic growth mode, the new shape being a wholly primary form without side-arms. The absence of fragmentation in this range (△T > 70°) suggests that self-buckling contributes to fragmentation in the other range (△T < 70°) and could be at least equal in importance to remelting.

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Authors and Affiliations

  1. Alcan Australia Limited, Granville, N.S.W., Australia

    A. J. McLeod (Staff Metallurgist)

  2. Department of Mining and Metallurgical Engineering, University of Queensland, St. Lucia, Queensland, Australia

    L. M. Hogan (Reader in Physical Metallurgy)

Authors
  1. A. J. McLeod
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  2. L. M. Hogan
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Additional information

Formerly with the University of Queensland, Australia, and the National Research Council of Canada, Ottawa

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McLeod, A.J., Hogan, L.M. Crystal multiplication in undercooled Cu + 2 Pct Sn alloy. Metall Trans A 9, 987–998 (1978). https://doi.org/10.1007/BF02649844

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  • DOI: https://doi.org/10.1007/BF02649844

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