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The role of boron in ductilizing Ni3Al

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Abstract

Ductilization of Ni3Al at room temperature by microalloying with boron has been primarily attributed to the increased grain boundary cohesion in the presence of boron.1 However, another aspect of the role played by boron in ductilizing Ni3Al is revealed when the Hall-Petch relationships for Ni3Al and B-doped Ni3Al are compared. A shallower slope for the B-doped Ni3Al compared to that for Ni3Al indicates a reduced resistance to slip propagation across grain boundaries, and therefore reduced stress concentration at boundaries, in the presence of boron. This comparison of Hall-Petch relationships was carried out by generating data for powder processed B-doped Ni3Al at various grain sizes and by compiling data for Ni3Al from the literature. In addition, the room temperature fracture of B-doped Ni3Al has been shown to initiate along certain grain boundaries. The fracture eventually occurs by transgranular ductile tearing.

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Authors and Affiliations

  1. Department of Metallurgy and Materials Science, Case Western Reserve University, 44106, Cleveland, OH

    P. S. Khadkikar (Graduate Student) & K. Vedula (Associate Professor of Metallurgy)

  2. Alloy Technology Division, Alcoa Laboratories, Alcoa Center, 15069, PA

    B. S. Shabel (Scientific Associate)

Authors
  1. P. S. Khadkikar
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  2. K. Vedula
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  3. B. S. Shabel
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Khadkikar, P.S., Vedula, K. & Shabel, B.S. The role of boron in ductilizing Ni3Al. Metall Trans A 18, 425–428 (1987). https://doi.org/10.1007/BF02648803

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  • DOI: https://doi.org/10.1007/BF02648803

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