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Effect of grain size on the thermal diffusion of copper in aluminum

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Abstract

The effect of grain size upon the thermal diffusion of copper in aluminum has been investigated. It is found that the heat of transport of copper in fine-grained aluminum is 10.8 kcal/mole, and -7.1 kcal/mole is found in large-grained samples. This grainsize dependence is opposite to that found in self-thermal diffusion of aluminum by Matlock and Stark1 where the large-grained samples had the larger heat of transport. This copper result might be expected if vacancies are tightly bound to copper atoms in aluminum since the copper flux is antiparallel to that of aluminum and parallel to the vacancy flux. The difference in the heat of transport of copper in aluminum for small and large-grained samples is apparently equal to the heat of vacancy formation in aluminum. The observed difference of 17.9 kcal/mole is in numerical agreement with the value of 17.5 kcal/mole obtained by Simmons and Balluffi.2

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References

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Authors and Affiliations

  1. Tracor, Inc., Austin, Tex.

    R. E. Doerr

  2. University of Texas, Austin, Tex.

    J. P. Stark (Associate Professor of Mechanical Engineering)

Authors
  1. R. E. Doerr
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  2. J. P. Stark
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Additional information

R. E. DOERR, Formerly Graduate Student, Department of Mechanical Engineering, University of Texas at Austin, Austin, Tex.

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Doerr, R.E., Stark, J.P. Effect of grain size on the thermal diffusion of copper in aluminum. Metall Trans 3, 2461–2464 (1972). https://doi.org/10.1007/BF02647050

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  • DOI: https://doi.org/10.1007/BF02647050

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