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Stress corrosion cracking of copper bicrystals with 〈110〉-Tilt ∑3, ∑9, and ∑11 coincident site lattice boundaries

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Abstract

The stress corrosion cracking (SCC) behavior of copper bicrystals with 〈HO〉-tilt ∑3(111), ∑9(221), and ∑11(311) coincident site lattice (CSL) boundaries was investigated. Stress corrosion cracking tests were carried out in 1 N NaNO2 aqueous solution at 303 ±2 K using a slow strain rate technique (SSRT). Transgranular SCC occurred along the primary slip traces on the top surface of the bicrystal having a ∑3(111) coincidence boundary. No cracks initiated on the grain boundary except for very small and shallow corrosion pits. In contrast, for the bicrystals with ∑9(221) or ∑11(311) coincidence boundaries, corrosion pits and cracks initiated on the grain boundary and propagated into the crystal interior along {110} traces, which are almost perpendicular to the tensile axis. The SCC behavior is closely related to the activated slip systems and the degrees of crystal rotation owing to deformation. Susceptibility to intergranular SCC is affected by the angle between the Burgers vector of the primary slip system and the grain boundary plane. The susceptibility of the ∑23(111) boundary to SCC is remarkably low in comparison with the other two types of grain boundaries.

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Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, Doshisha University, 602, Kyoto, Japan

    T. Mimaki (Professor)

  2. Scientist with Asahi Kasei Co. Ltd., 712, Kurashiki, Japan

    Y. Nakazawa

  3. Department of Engineering Science, Faculty of Engineering, Kyoto University, 606, Kyoto, Japan

    S. Hashimoto (Associate Professor) & S. Miura (Professor)

Authors
  1. T. Mimaki
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  2. Y. Nakazawa
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  3. S. Hashimoto
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  4. S. Miura
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Additional information

Y. Nakazawa, formerly Graduate Student, Department of Mechanical Engineering, Doshisha University

This paper is based on a presentation made in the symposium “Interface Science and Engineering” presented during the 1988 World Materials Congress and the TMS Fall Meeting, Chicago, IL, September 26–29, 1988, under the auspices of the ASM-MSD Surfaces and Interfaces Committee and the TMS Electronic Device Materials Committee.

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Mimaki, T., Nakazawa, Y., Hashimoto, S. et al. Stress corrosion cracking of copper bicrystals with 〈110〉-Tilt ∑3, ∑9, and ∑11 coincident site lattice boundaries. Metall Trans A 21, 2355–2361 (1990). https://doi.org/10.1007/BF02646982

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