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Importance of microplasticity in the fracture of silicon

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Abstract

Notched, wedge-shaped silicon crystals were subjected to tensile deformation and canti-lever bending in the temperature range 500 to 800°C. The microplastic zones and elastic strain distribution ahead of the propagating crack were disclosed by combining various sensitive X-ray diffraction and electron microscopy methods. The importance of the mi-croplastic zones for the notch-brittle sensitivity was shown. The changes in fracture stress with deformation temperature were attributed to the ability of the strain-hardened plastic zones to constrain the residual elastic strains. Upon annealing, the elastic strains were eliminated by the sweeping of dislocation loops emanating from the boundaries of the con-straining microplastic zones.

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Authors and Affiliations

  1. Materials Research Laboratory, Rutgers Uni-versity, The State University of New Jersey, 08903, New Brunswick, N. J.

    Y. Tsunekawa (Graduate Student) & S. Weissmann (Professor)

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  1. Y. Tsunekawa
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  2. S. Weissmann
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This paper is based upon a thesis submitted by Y. TSUNEKAWA in partial fulfillment of the requirements for the degree of Doctor of Philosophy at Rutgers University

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Tsunekawa, Y., Weissmann, S. Importance of microplasticity in the fracture of silicon. Metall Trans 5, 1585–1593 (1974). https://doi.org/10.1007/BF02646330

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