Skip to main content
SpringerLink
Log in

Reaction layer characterization of the braze joint of silicon nitride to stainless steel

  • Published:
Journal of Materials Engineering and Performance Aims and scope Submit manuscript

Abstract

This investigation studies the role of titanium in the development of the reaction layer in braze joining silicon nitride to stainless steel using titanium-active copper-silver filler metals. This reaction layer formed as a result of titanium diffusing to the filler metal/silicon nitride interface and reacting with the silicon nitride to form the intermetallics, titanium nitride (TiN) and titanium suicide (Ti 5Si3). This reaction layer, as recognized in the literature, allows wetting of the ceramic substrate by the molten filler metal. The reaction layer thickness increases with temperature and time. Its growth rate obeys the parabolic relationship. Activation energies of 220.1 and 210.9 kj/mol were calculated for growth of the reaction layer for the two filler metals used. These values are close to the activation energy of nitrogen in TiN (217.6 kj/mol). Two filler metals were used in this study, Ticusil (68.8 wt% Ag, 26.7 wt% Cu, 4.5 wt% Ti) and CB4 (70.5 wt% Ag, 26.5 wt% Cu, 3.0 wt% Ti). The joints were processed in vacuum at temperatures of 840 to 900 °C at various times. Bonding strength is affected by reaction layer thickness in the absence of Ti-Cu intermetallics in the filler metal matrix.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. A.J. Moorhead,Weld.J., Vol 62 (No. 10), 1984, p 17–22

    Google Scholar 

  2. M. Naka, T. Tanaka, I. Okamoto, and Y. Arata,Trans. JWR1, Vol 12 (No. 2), 1983, p 177–180

    Google Scholar 

  3. M. Naka, K. Sampath, I. Okamoto, and Y. Arata,Trans. JWRI, Vol 12 (No. 2), 1983, p 181–183

    Google Scholar 

  4. AJ. Moorhead and H. Keting,Welding J., Vol 65 (No. 10), 1980, p 17–31

    Google Scholar 

  5. A.J. Moorhead,Adv. Ceram. Mater., Vol 2 (No. 2), 1987, p 159–166

    CAS  Google Scholar 

  6. H. Mizuhara, E. Huebel, and T. Oyama,Am. Ceram. Soc. Bull., Vol 68 (No. 9), 1989, p 1591–1599

    CAS  Google Scholar 

  7. X.S. Ning, K. Suganuma, A. Koreeda, and Y. Miyamoto,J. Mater. Sci., Vol 24, 1989, p 2879–2883

    Article  CAS  Google Scholar 

  8. C.H. Hsueh and A.G. Evans,J. Am. Ceram. Soc, Vol 68 (No. 5), 1985, p 241–248

    Article  CAS  Google Scholar 

  9. K. Suganuma, T. Okamoto, and M. Koizumi,Communications of the Am. Ceram. Soc, Dec 1984, p c-256 to c-257

  10. P.A. Wall and M. Ueki,J. Am. Ceram. Soc, Vol 75 (No. 9), 1992, p2491–2497

    Article  Google Scholar 

  11. A.G. Varias, Z. Suo, and CF. Shih,J. Mech. Phys. Solids, Vol 39 (No. 7), 1991, p 963–986

    Article  Google Scholar 

  12. D.H. Kum, S.H. Hwang, and S.S. Chun,Ceram. Int., Vol 16, 1990, p 333–347

    Article  Google Scholar 

  13. M.O. Nicholas, D.A. Mortimer, L.M. Jones, and R.M. Crispin,J. Mater. Sei., Vol 25, 1990, p 2679–2689

    Article  CAS  Google Scholar 

  14. R.R. Kapoor and T.W. Eagar,J. Am. Ceram. Soc, Vol 72 (No. 3), 1989, p 448–454

    Article  CAS  Google Scholar 

  15. J.H. Selverian and S. Kang,Weld. J., Vol 71 (No. 1), 1992, p 25s-33s

    Google Scholar 

  16. R.E. Loehman, A.P. Tomsia, J.A. Pask, and S.M. Johnson,J. Am. Ceram. Soc, Vol 73 (No. 3), 1990, p 552–558

    Article  CAS  Google Scholar 

  17. M. Naka, I. Okamoto, and Y. Arata,Mater. Sci. Eng., Vol 98, 1988, p 407–410

    Article  CAS  Google Scholar 

  18. Y. Nakao, K. Nishimoto, and K. Saida,Trans. Jpn. Weld. Soc, Vol 20 (No. 1), 1989, p 66–76

    CAS  Google Scholar 

  19. R. Xu, J.E. Indacochea, and S. Harren,Proc. of 3rd Inter. Conf. on Brazing, High Temperature Brazing and Diffusion Welding, Aachen, Germany, Nov 1992

    Google Scholar 

  20. J.L. Murray, Ti-Cu,Binary Alloy Phase Diagrams, T.B. Massalski, Ed., American Society for Metals, Metals Park, OH, 1986

    Google Scholar 

  21. D.H. Kim, S.H. Hwang, and S.S. Chun,J. Mater. Sci., Vol 26, 1991,p 3223–3234

    Article  CAS  Google Scholar 

  22. A.P. Xian and Z.Y. Si,J. Mater. Sci., Vol 25, 1990, p 4483–4487

    Article  CAS  Google Scholar 

  23. K. Suganuma, T. Okamoto, Y. Miyamiti, M. Shimada, and M. Koizumi,Mater. Sci. Technol., Vol 2, 1986, p 1156–1161

    CAS  Google Scholar 

  24. A.E. Morgan, E.K. Broadbent, and D.K. Sadana,Appl. Phvs. Lett., Vol 49 (No. 19), 1986, p 1236–1238

    Article  CAS  Google Scholar 

  25. J.C. Barbour, A.E.T. Kuiper, M.F.C. Willemsen, and A.H. Reader,Appl. Phys. Lett., Vol 50 (No. 15), 1987, p 953–955

    Article  CAS  Google Scholar 

  26. R. Beyers and R. Sinclair,J. Vac Sci. Technol., Vol B2 (No. 4), 1984 Oct-Dec, p 781–784

    Google Scholar 

  27. L. Kaufman, Coupled phase diagrams and thermochemical data for transition metal binary systems-Ill,Calphad, Vol 2 (No. 2),1977, p 117–146

    Article  Google Scholar 

  28. J.J. Pak, M.L. Santella, and R.J. Fruehan,Metall. Trans. B, Vol 21, 1990, p 349–355

    Google Scholar 

  29. Y. Shichi, M. Arita, and M. Matsunaga, Study of Joining Interface Between Si3N4 and Ag-Cu-Ti Active Metal,J. Ceram. Soc Jpn., Vol 96 (No.9), 1988, p 930–934

    CAS  Google Scholar 

  30. C.H.P. Lupis,Chemical Thermodynamics of Materials, North-Holland, 1983, p 351

  31. W.W. Smeltzer and J.G. Desmaison, Nitrogen Ceramics, F.L. Riley, Ed., 1977, p 219–235

  32. L. Zakraysek, Intermetallic Growth in Tin-Rich Solders,Weld. J., Vol 37(No. 11), 1972, p 536s-541s

    Google Scholar 

  33. E.K. Ohriner, Intermetallic Formation in Soldered Copper-Based Alloys at 150 to 250 °C,Weld. J., Vol 66 (No. 7), 1987, p 191s-202s

    Google Scholar 

  34. A.W. Adamson, Physical Chemistry of Surfaces, New York, John Wiley & Sons, Inc., Fifth Edition, 1990

Download references

Author information

Authors and Affiliations

  1. Civil and Materials Engineering Dept. (m/c 246), University of Illinois at Chicago, 60680, Chicago, IL, USA

    R. Xu & J. E. Indacochea

Authors
  1. R. Xu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. J. E. Indacochea
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Xu, R., Indacochea, J.E. Reaction layer characterization of the braze joint of silicon nitride to stainless steel. JMEP 3, 596–605 (1994). https://doi.org/10.1007/BF02645257

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF02645257

Keywords:

Search

Navigation