Abstract
Spontaneous growth of zinc whiskers from electroplate was studied at 20°C and 50°C for a period of two years after electroplating and a number of physical and metallurgical properties of the electroplate were determined. The growth rate correlated well with the internal macrostress of the deposit as determined with a dilatometer during plating. Crystallographic texture and a microstructure of flat lath-like grains also tended to favor growth somewhat, while grain size, microhardness and microstrain had no apparent effect.
Similar content being viewed by others
References
K. G. Compton, A. Mendizza, and S. M. Arnold:Corrosion, 1951, vol. 7, pp. 327–34.
S. M. Arnold:43rd Annual Tech. Proc, pp. 26–31, Am. Electroplaters Soc, 1956.
S. E. Koonce and S. M. Arnold:J. Appl. Phys., 1953, vol. 24, pp. 365–66.
P. L. Key: Bell Laboratories, Murray Hill, N. J., unpublished research, 1974.
P. L. Key:Proc. 20th Electronic Comp. Conf., pp. 155–60, 1970.
W. Marchand:Trans. Inst. Metal Finish, 1961, vol. 38, pp. 59–65.
S. C. Britton and M. Clarke:Trans. Inst. Metal Finish, 1963, vol. 40, pp. 206–11.
A. Politycki and H.-P. Kehrer:Z. Metallic, 1968, vol. 59, pp. 309–13.
R. M. Fisher, L. S. Darken, and K. G. Carroll:Acta Met, 1954, vol. 2, pp. 368–73.
U. Lindborg: L M Ericsson Telephone Company, Stockholm, Sweden, unpublished research, 1974.
U. Lindborg, S. Ramsin, L. Lind, and L. Révay:Plating, 1974, vol. 61, pp. 1111–16.
A. Dvorak and L. Vrobel:Trans. Inst. Metal Finish, 1971, vol. 49, pp. 153–55.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Lindborg, U. Observations on the growth of whisker crystals from zinc electroplate. Metall Trans A 6, 1581 (1975). https://doi.org/10.1007/BF02641971
Received:
DOI: https://doi.org/10.1007/BF02641971