Abstract
Thermal analysis techniques have been employed to elucidate the mechanism of low solids soldering flux activation. Metal oxides (SnO, PbO and PbO2) are converted to carboxylate salts, which are displaced in the solder wave, rendering a solderable metal surface. Neither of the activators tested, namely succinic acid and adipic acid, react with SnO2 at soldering wave temperatures and therefore cannot yield a solderable surface when SnO2 is present. Further, adipic acid reacts with SnO to form a salt that can decompose to cyclopentanone, so the preheating of the printed circuit board must be carefully controlled to yield a solderable surface.
Zusammenfassung
Metalloxide (SnO, PbO und PbO2) werden in ihre Carboxylatsalze überführt, in dessen Folge eine lötfähige Metalloberfläche ermöglicht wird. Keiner der getesteten Aktivatoren, namentlich Bernsteinsäure und Adipinsäure reagiert mit SnO2 bei Lötofentemperatur, weshalb in Gegenwart von SnO2 keine lötfähige Oberfläche erzielt werden kann. Weiterhin reagiert Adipinsäure mit SnO und bildet ein Salz, welches sich zu Cyclopentanon zersetzen kann, weshalb das Vorwärmen der gedruckten Leiterplatte sorgfältig überwacht werden muß, um eine lötfähige Oberfläche zu erhalten.
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Patterson, M.L., Hahn, M.H. Characterization of nitrogen-blanketed wave soldering reactions using thermal analysis. Journal of Thermal Analysis 44, 1233–1250 (1995). https://doi.org/10.1007/BF02549214
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DOI: https://doi.org/10.1007/BF02549214