Acta Mechanica Sinica

, Volume 8, Issue 3, pp 261–270 | Cite as

Elastic-plastic crack growth on plane strain bimaterial interface

  • Luo Xuefu
  • S. Aoki


Finite element computation are carried out to simulate plane strain crack growth on a bimaterial interface under the assumption of small scale yielding. The modified Gurson constitutive equation and the element vanish technique introduced by Tvergaard et al. are used to model the final formation of an open crack. It is found from the calculation that the critical fracture toughness for crack growth is much lower in bimaterials than that in homogeneous material. The critical fracture toughness is strongly dependent on material properties of the bimaterial pair and the mixed mode of remote loads. The interface crack grows in the more compliant (lower hardening) material or in the weaker (lower yield strength) material. In Mode-I loading, the crack grows zigzag along the interface.

Key Words

interface crack growth plane strain modified Gurson's model 


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Copyright information

© Chinese Society of Theoretical and Applied Mechanics 1992

Authors and Affiliations

  • Luo Xuefu
    • 1
  • S. Aoki
    • 2
  1. 1.Tsinghua UniversityBeijingChina
  2. 2.Tokyo Institute of TechnologyJapan

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