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Experimental Mechanics

, Volume 43, Issue 3, pp 289–302 | Cite as

Fatigue damage evolution in silicon films for micromechanical applications

  • P. Shrotriya
  • S. Allameh
  • S. Brown
  • Z. Suo
  • W. O. Soboyejo
Article

Abstract

In this paper we examine the conditions for surface topography evolution and crack growth/fracture during the cyclic actuation of polysilicon microelectromechanical systems (MEMS) structures. The surface topography evolution that occurs during cyclic fatigue is shown to be stressassisted and may be predicted by linear perturbation analyses. The conditions for crack growth (due to pre-existing or nucleated cracks) are also examined within the framework of linear elastic fracture mechanics. Within this framework, we consider pre-existing cracks in the topical SiO2 layer that forms on the Si substrate in the absence of passivation. The thickening of the SiO2 that is normally observed during cyclic actuation of Si MEMS structures is shown to increase the possibility of stable crack growth by stress corrosion cracking prior to the onset of unstable crack growth in the SiO2 and Si layers. Finally, the implications of the results are discussed for the prediction of fatigue damage in silicon MEMS structures.

Key Words

Fatigue polysilicon MEMS surface topography evolution crack growth 

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References

  1. 1.
    Madou, M., Fundamentals of Microfabrication, 2nd edition, CRC Press, New York (2002).Google Scholar
  2. 2.
    Roming, A.D., “Opportunities and Challenges in MEMS Commercialization,” Vacuum Technology and Coating (2001).Google Scholar
  3. 3.
    Brown, S.B., Van Arsdell, W., and Muhlstein, C.L., “Materials Reliability in MEMS Devices,” International Solid State Sensors and Actuators Conference (Transducers'97), Chicago, IL (1997).Google Scholar
  4. 4.
    Jones, P.T., Johnson, G.C., and Howe, R.T., “Fracture Strength of Polycrystalline Silicon,” presented at Microelectromechanical Structures for Materials Research-Symposium N (1998).Google Scholar
  5. 5.
    LaVan, D. and Buchheit, T.E., “Testing of Critical Features of Polysilicon MEMS,” presented at Symposium MM, Materials Science of Microelectromechanical Systems (MEMS) Devices II, Boston, MA (1999).Google Scholar
  6. 6.
    Brown, S.B., Arsdell, W.V., and Muhlstein, C.L., “Materials Reliability in MEMS Devices,” Transducers 97, International Conference on Solid-State Sensors and Actuators, Digest of Technical Papers (1997).Google Scholar
  7. 7.
    Kahn, H., Ballarini, R.L., Mullen, R., andHeuer, A.H., “Electrostatically Actuated Failure of Microfabricated Polysilicon Fracture Mechanics Specimens,”Proc. Roy. Soc., Series A (Mathematical, Physical and Engineering Sciences),455,3807–3823 (1999).Google Scholar
  8. 8.
    Kapels, H., Aigner, R., and Bider, J., “Fracture Strength and Fatigue of Polysilicon Determined by A Novel Thermal Actuator [MEMS],” 29th European Solid-State Device Research Conference, Leuven, Belgium (1999).Google Scholar
  9. 9.
    Muhlstein, C.L., Brown, S., and Ritchie, R.O., “High Cycle Fatigue of Polycrystalline Silicon Thin Films in Laboratory Air,” Materials Science of Microelectromechanical System (MEMS) Devices III, Boston, MA (2000).Google Scholar
  10. 10.
    Muhlstein, C.L., Brown, S., andRitchie, R.O., “High Cycle Fatigue of Single Crystal Silicon Thin Film,”J. Microelectromech. Syst.,10,593–600 (2001).CrossRefGoogle Scholar
  11. 11.
    Muhlstein, C.L., Howe, R.T., and Ritchie, R.O., “Fatigue of Polycrystalline Silicon for MEMS Applications: Crack Growth and Stability under Resonant Loading Conditions,” Mechanics of Materials (2002).Google Scholar
  12. 12.
    Allameh, S.M., Gally, B., Brown, S., and Soboyejo, W.O., “On the Evolution of Surface Morphology of Polysilicon MEMS Structures During Fatigue,” Materials Science of Microelectromechanical System (MEMS) Devices III, Boston, MA (2000).Google Scholar
  13. 13.
    Ritchie, R.O., “Mechanisms of Fatigue Crack Propagation in Ductile and Brittle Solids,”Int. J. Fract.,100,55–83 (1999).CrossRefGoogle Scholar
  14. 14.
    Suresh, S., Fatigue of Materials, 2nd edition, Cambridge University Press (1998).Google Scholar
  15. 15.
    Kahn, H., Tayebi, N., Ballarini, R.L., Mullen, R., and Heuer, A.H., “Fracture Toughness of Polysilicon MEMS Devices,” 10th International Conference on Solid State Sensors and Actuators (Transducers '99), Sendai, Japan (1999).Google Scholar
  16. 16.
    Muhlstein, C.L., Stach, E.A., and Ritchie, R.O., “Mechanism of Fatigue in Micron-scale Films of Polycrystalline Silicon for MEMS Applications,” Appl. Phys. Lett. (2001).Google Scholar
  17. 17.
    Allameh, S.M., Gally, B., Brown, S., andSoboyejo, W.O., “Surface Topology and Fatigue in Si MEMS Structures,”in Mechanical Properties of Structural Films, Vol. STP 1413, 3–16, C.L. Muhlstein andS. Brown, eds., American Society for Testing and Materials, West Conshohocken, PA (2001).Google Scholar
  18. 18.
    Sharpe, W.N., “Variation in Mechanical Properties of Polysilicon,” 43rd International Symposium of Instrumentation Society of America, Orlando, FL (1997).Google Scholar
  19. 19.
    Kim, K.-S., Hurtado, J.A., andTan, H., “Evolution of Surfaceroughness Spectrum Caused by Stress in Nanometer-scale Chemical Etching,”Physical Review Letters,83,3872–3875 (1999).Google Scholar
  20. 20.
    Bergen, J.R., Anandan, P., Hanna, K., and Hingorani, R., “Hierarchical Model-based Motion Estimation,” Proceedings of Second European Conference on Computer Vision (1992).Google Scholar
  21. 21.
    Yang, W.H. andSrolovitz, D.J., “Surface Morphology Evolution in Stressed Solids: Surface Diffusion Controlled Crack Initiation,”J. Mech. Phys. Solids,42,1551–1574 (1994).MathSciNetGoogle Scholar
  22. 22.
    Yu, H.H. andSuo, Z., “Delayed Fracture of Ceramics Caused by Stress-dependent Surface Reactions,”Acta Meter.,47,77–88 (1999).Google Scholar
  23. 23.
    Mullins, R., “Theory of Thermal Grooving,”J. Appl. Phys.,28,333–339 (1957).CrossRefGoogle Scholar
  24. 24.
    Srolovitz, D.J., “On the Stability of Surfaces of Stressed Solids,”Acta Metall. Mater.,37,621–625 (1989).CrossRefGoogle Scholar
  25. 25.
    Yu, H.H. andSuo, Z., “Stress-dependent Surface Reactions and Implications for a Stress Measurement Technique,”J. Appl. Phys.,87,1211–1218 (2000).Google Scholar
  26. 26.
    Iler, R.K., Chemistry of Silica, Wiley, New York (1979).Google Scholar
  27. 27.
    Beuth, J.L., “Cracking of Thin Bonded Films in Residual Tension,”Int. J. Solids Struct.,29,1657–1675 (1992).Google Scholar
  28. 28.
    Ye, T., Suo, Z., andEvans, A.G., “Thin Film Cracking and the Roles of Substrate and Interface,”Int. J. Solids Struct.,29,2639–2648 (1992).Google Scholar
  29. 29.
    Lawn, B.R., Fracture of Brittle Solids, 2nd edition, Cambridge University Press, Cambridge (1993).Google Scholar

Copyright information

© Society for Experimental Mechanics 2003

Authors and Affiliations

  • P. Shrotriya
    • 1
  • S. Allameh
    • 1
  • S. Brown
    • 2
  • Z. Suo
    • 1
  • W. O. Soboyejo
    • 1
  1. 1.Princeton Materials Institute and Department of Mechanical and Aerospace EngineeringPrinceton UniversityPrinceton
  2. 2.Exponent Failure AssociatesNatick

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