Experimental Mechanics

, Volume 43, Issue 3, pp 248–255

A review of MEMS-based microscale and nanoscale tensile and bending testing

  • M. A. Haque
  • M. T. A. Saif

DOI: 10.1007/BF02410523

Cite this article as:
Haque, M.A. & Saif, M.T.A. Experimental Mechanics (2003) 43: 248. doi:10.1007/BF02410523


Thin films at the micrometer and submicrometer scales exhibit mechanical properties that are different than those of bulk polycrystals. Industrial application of these materials requires accurate mechanical characterization. Also, a fundamental understanding of the deformation processes at smaller length scales is required to exploit the size and interface effects to develop new and technologically attractive materials. Specimen fabrication, small-scale force and displacement generation, and high resolution in the measurements are generic challenges in microscale and nanoscale mechanical testing. In this paper, we review small-scale materials testing techniques with special focus on the application of microelectromechanical systems (MEMS). Small size and high force and displacement resolution make MEMS suitable for small-scale mechanical testing. We discuss the development of tensile and bending testing techniques using MEMS, along with the experimental results on nanoscale aluminum specimens.

Key Words

Mems tensile tesing bending testing thin films 

Copyright information

© Society for Experimental Mechanics 2003

Authors and Affiliations

  • M. A. Haque
    • 1
  • M. T. A. Saif
    • 1
  1. 1.Department of Mechanical and Industrial EngineeringUniversity of Illinois at Urbana-ChampaignUrbanaM.A.
  2. 2.Department of Mechanical and Nuclear EngineeringThe Pennsylvania State UniversityUniversity Park

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