Experimental Mechanics

, Volume 38, Issue 4, pp 278–288 | Cite as

Recent advancements of moiré and microscopic moiré interferometry for thermal deformation analyses of microelectronics devices

Article

Abstract

Moiré and microscopic moiré interferometry are reviewed as they are applied to thermal deformation analyses of microelectronics devices. Applications to diverse problems are illustrated to demonstrate wide applicability of the methods. The whole-field displacement information, with various sensitivity and resolution scales, is ideally suited for the deformation study of a broad range of problems in deformation analyses of microelectronics devices.

Key Words

Moiré interferometry microscopic moiré interferometry thermal deformation microelectronics device electronic packaging coefficient of thermal expansion 

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References

  1. 1.
    Tummala, R. andRymaszewski, E., eds., Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York (1989).Google Scholar
  2. 2.
    Post, D., Han, B., andIfju, P., High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials, Springer-Verlag, New York (1994).Google Scholar
  3. 3.
    Han, B., “Higher Sensitivity Moiré Interferometry for Micromechanics Studies,”Opt. Eng.,31,1517–1526 (1992).CrossRefGoogle Scholar
  4. 4.
    Han, B., “Interferometric Methods with Enhanced Sensitivity by Optical/Digital Fringe Multiplication,”Appl. Optics,32,4713–4718 (1993).Google Scholar
  5. 5.
    Guo, Y., Lim, C.K., Chen, W.T., andWoychik, C.G., “Solder Ball Connect (SBC) Assemblies Under Thermal Loading: I. Deformation Measurement via Moiré Interferometry, and Its Interpretation,”IBM J. Research Development,37,635–648 (1993).Google Scholar
  6. 6.
    Post, D. andWood, J., “Determination of Thermal Strains by Moiré Interferometry, EXPERIMENTAL MECHANICS,29,318–322 (1989).CrossRefGoogle Scholar
  7. 7.
    Guo, Y., Chen, W., and Lim, C.K., “Experimental Determination of Thermal Strains in Semiconductor Packaging Using Moiré Interferometry,” Proceedings of the ASME/JSME Joint Conference on Electronic Packaging, San Jose, California, 779–784 (1992).Google Scholar
  8. 8.
    Post, D., “Moiré Interferometry in White Light,”Appl. Optics,18,4163–4167 (1979).Google Scholar
  9. 9.
    Mollenhauer, D.H., Ifju, P., andHan, B., “A Compact, Robust, and Versatile Moiré Interferometer,”Optics Lasers Eng.,23,29–40 (1995).Google Scholar
  10. 10.
    Han, B., Chopra, M., Park, S., Li, L., andVerma, K., “Effect of Substrate CTE on Solder Ball Reliability of Flip-chip PBGA Package Assembly,”J. Surface Mount Tech.,9,43–52 (1996).Google Scholar
  11. 11.
    Han, B. andGuo, Y., “Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry,”J. Electronic Packaging, Trans. ASME,117,185–191 (1995).Google Scholar
  12. 12.
    Han, B., “Deformation Mechanism of Two-phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: An Experimental Study,”J. Electronic Packaging, Trans. ASME,119,189–196 (1997).Google Scholar
  13. 13.
    Han, B. andGuo, Y., “Photomechanics Tools as Applied to Electronic Packaging Product Development,”Experimental/Numerical Mechanics in Electronics Packaging, ed. B. Han, R. Mahajan andD. Barker,1,Society for Experimental Mechanics,Bethel, CT,11–18 (1997).Google Scholar
  14. 14.
    Han, B., Guo, Y., Lim, C.K., andCaletka, D., “Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods,”J. Electronic Packaging, Trans. ASME,118,157–163 (1996).Google Scholar
  15. 15.
    Ramakrishna, K. andHan, B., “Predetermined Boundary Conditions for the Unit Cell Model Used in the Stress Analysis of Plated Through Hole,”Proceedings of 1996 International Mechanical Engineering Congress & Exposition, 95-WA/EEP-1, ASME, San Francisco (1995).Google Scholar
  16. 16.
    Han, B. andGuo, Y., “Determination of Effective Coefficient of Thermal Expansion of Electronic Packaging Components: A Whole-field Approach,”IEEE Trans. Components, Packaging and Manufacturing Technology-Part A,19,240–247 (1996).Google Scholar
  17. 17.
    Wu, T.Y., Guo, Y., andChen, W.T., “Thermal-mechanical Strain Characterization for Printed Wiring Boards,”IBM J. Research Development,37,621–634 (1993).Google Scholar
  18. 18.
    Han, B., Guo, Y., and Caletka, D., “On the Effect of Moiré Specimen Preparation on Solder Ball Strains of Ball Grid Array Package Assembly,” Proceedings of the 1995 SEM Spring Conference on Experimental Mechanics, Grand Rapids, Michigan (1995).Google Scholar
  19. 19.
    Norris, K.C. and Landzberg, A.H., “Reliability of Controlled Collapse Interconnections,” IBM J. Research Development,13 (1969).Google Scholar
  20. 20.
    Lin, P., Lee, J., and Im, S., “Design Considerations for a Flip-chip Joining Technique,” Solid State Tech., 48–54 (1970).Google Scholar

Copyright information

© Society for Experimental Mechanics, Inc. 1998

Authors and Affiliations

  • B. Han
    • 1
  1. 1.Mechanical Engineering DepartmentClemson UniversityClemson

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