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Journal of Materials Science

, Volume 27, Issue 1, pp 49–54 | Cite as

Diffusion bonding of beryllium-copper alloys

  • D. C. Eckman
  • B. Z. Rosenblum
  • C. Q. Bowles
Papers

Abstract

A process has been developed for diffusion-bonding identical beryllium-copper alloy, 1.8 to 2.0 wt% Be, which has produced bond strengths comparable to that of the bulk. Bonding resulted from self-diffusion between two Be-Cu samples, brought into intimate contact and heated in a high vacuum. Metallurgical analyses of the diffusion bonds revealed the bond interface to be a continuous high-angle planar boundary. The analyses also revealed that oxides were present at the interface after bonding. The agreement between the experimental results and a theoretical model for diffusion-bonding of pure copper, derived by Hill and Wallach, was good.

Keywords

Oxide Polymer Copper Theoretical Model Bond Strength 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Chapman & Hall 1992

Authors and Affiliations

  • D. C. Eckman
    • 1
  • B. Z. Rosenblum
    • 1
  • C. Q. Bowles
    • 2
  1. 1.Kansas City DivisionAllied-Signal Inc.Kansas CityUSA
  2. 2.University of MissouriKansas CityUSA

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