Diffusion bonding of beryllium-copper alloys
- 104 Downloads
A process has been developed for diffusion-bonding identical beryllium-copper alloy, 1.8 to 2.0 wt% Be, which has produced bond strengths comparable to that of the bulk. Bonding resulted from self-diffusion between two Be-Cu samples, brought into intimate contact and heated in a high vacuum. Metallurgical analyses of the diffusion bonds revealed the bond interface to be a continuous high-angle planar boundary. The analyses also revealed that oxides were present at the interface after bonding. The agreement between the experimental results and a theoretical model for diffusion-bonding of pure copper, derived by Hill and Wallach, was good.
KeywordsOxide Polymer Copper Theoretical Model Bond Strength
Unable to display preview. Download preview PDF.
- 1.“Guide to Beryllium Copper” (Brush Wellman Inc., Alloy Division, Cleveland, Ohio, 1988).Google Scholar
- 2.J. A. Huffman, G. R. Baxter, R. C. Bertossa andB. R. Cottrell,Welding Res. Suppl. (April 1962) 160–s.Google Scholar
- 3.R. W. Cahn, “Physical Metallurgy” (North Holland, Amsterdam, 1970) pp. 383–401.Google Scholar
- 4.P. G. Shewmon, “Diffusion in Solids” (McGraw-Hill, New York, 1963) pp. 2–37 and 40–83.Google Scholar
- 5.R. E. Reed-Hill, “Physical Metallurgy Principles”, 2nd Edn (Van Nostrand, New York, 1973) pp. 378–430.Google Scholar
- 7.A. D. Smigelskas andE. O. Kirkendall,Trans. AIME171 (1947) 130–142.Google Scholar
- 9.“Metal Finishing Guidebook and Directory”, Vol. 80, No. 1A, issue 1982 (Plastics Publications Inc, Hackensack, NJ) p. 175.Google Scholar
- 10.H. J. Frost andM. F. Ashby, “Deformation Mechanism Maps” (Pergamon, Oxford, 1982).Google Scholar