Abstract
We study the influence of a concentration of stresses in the vicinity of grain-boundary microvoids on their growth by the diffusion mechanism. For this purpose, we use the boundary-value diffusion problem formulated earlier on the basis of thermodynamical analysis of the “metal-microvoid” two-phase system. The distribution of stresses in the vicinity of microvoids, which is required to solve the problem, is determined by the method of finite elements. The results of calculations demonstrate that, at a high concentration of microvoids on the boundary of a grain, the influence of concentration of stresses is insignificant. Only for large values of the relative radius of microvoidsR/λ and a low concentration of microvoids (λ≥50μm) is the effect of concentration of stresses as large as 15–20%.
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Karpenko Physicomechanical Institute, Ukrainian Academy of Sciences, L'viv. Translated from Fizyko-Khimichna Mekhanika Materialiv, Vol. 35, No. 1, pp. 43–46, January–February, 1999.
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Skrypnyk, I.D., Lutchyn, V.B. & Student, O.Z. Numerical simulation of diffusion growth of a grain-boundary microvoid. Mater Sci 35, 42–47 (1999). https://doi.org/10.1007/BF02355600
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DOI: https://doi.org/10.1007/BF02355600