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Experimental study for reliability of electronic packaging under vibration

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Abstract

An automated fatigue-testing system was developed for an experimental study on the integrity of the electronic packaging subjected to mechanical vibration. The fatigue-testing machine utilized the electromagnetic device as an actuator. A data acquisition system was developed for the fatigue test of the electronic board. The fixture for the specimen was designed to be suitable for measuring the fatigue life of a typical module/lead/card electronic system subjected to vibration. With this automated fatiguetesting machine, the mechanical integrity of surface mount component with the spider gullwing leads has been studied by a mechanical flexural fatigue test. An experimental method was developed to measure the changes in electrical resistance in the lead, which is used to indicate a fatigue failure. Finally, a relationship between the loading force and the fatigue life of high-cycle region was discussed for the lead of spider gullwing type surface-mounted component. With the relation, the fatigue life of the surface-mounted component (SMC) subjected to vibration environment was predicted successfully.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Science Town, 305-701, Taejon, Korea

    S. -J. Ham (Graduate Student) & S. -B. Lee (Professor)

Authors
  1. S. -J. Ham
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  2. S. -B. Lee
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Ham, S.J., Lee, S.B. Experimental study for reliability of electronic packaging under vibration. Experimental Mechanics 36, 339–344 (1996). https://doi.org/10.1007/BF02328576

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  • DOI: https://doi.org/10.1007/BF02328576

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