Abstract
This paper presents an experimental investigation of the singular stress field near the vertex of a bimaterial wedge using a digital photoelastic technique. Special attention is given to the casting of bimaterial wedge specimens and analysis technique for extracting stress intensity factors from photoelastic samples. Different bimaterial wedge specimens are made of two different photoelastic materials bonded through a special casting procedure and loaded in simple tension. A new multiple-parameter method is developed to obtain the stress intensity factor reliably from the isochromatic fringe patterns and the series representation of the stress field at the vertex of the wedge. Experimental results are compared with finite element predictions, and good agreement is observed.
Similar content being viewed by others
References
Williams, M.L., “Stress Singularities Resulting from Various Boundary Conditions in Angular Corners of Plates in Extensions,”J. Appl. Mech.,19,526–528 (1952).
Hein, V.L. andErdogan, F., “On the Singular Behavior at the Vertex of a Bi-material Wedge,”Int. J. Fract.,7,317–330 (1971).
Theocaris, P.S., “The Order of Singularity at a Multi-wedge Corner of a Composite Plate,”Int. J. Eng. Sci.,12,107–120 (1974).
Dempsey, J.P. andSinclair, G.B., “On the Stress Singularities in the Plane Elasticity of the Composite Wedge,”J. Elasticity,9,373–391 (1979).
Dempsey, J.P. andSinclair, G.B., “On the Singular Behavior at the Vertex of a Bi-material Wedge,”J. Elasticity,11,317–327 (1981).
Chen, D.H. andNisitani, H., “Singular Stress Field Near the Corner of Jointed Dissimilar Materials,”J. Appl. Mech.,60,607–613 (1993).
Chen, Y.Z. andHasebe, N., “Singularity Eigenalue Analysis of a Crack along a Wedge-shaped Interface,”J. Appl. Mech.,60,781–783 (1993).
Gradin, P.A., “A Fracture Criterion for Edge Bonded Bimaterial Bodies,”J. Composite Mat.,16,448–456 (1982).
Groth, H.L., “A Method to Predict Fracture in an Adhesively Bonded Joint,”Int. J. Adhesion Adhesives,5,19–22 (1985).
Groth, H.L., “Stress Singularities and Fracture at Interface Corners in Bonded Joints,”Int. J. Adhesion Adhesives,8,107–113 (1988).
Munz, D. andYang, Y.Y., “Stress Singularities at the Interface in Bonded Dissimilar Materials under Mechanical and Thermal Loading,”J. Appl. Mech.,59,857–861 (1992).
Munz, D. andYang, Y.Y., “Stresses Near the Edge of Bonded Dissimilar Materials by Two Intensity Factors,”Int. J. Fract.,60,169–177 (1993).
Tan, M.A. andMeguid, S.A., “Analysis of Bimaterial Wedges Using a New Singular Finite Element,”Int. J. Fract.,88,373–381 (1998).
Lu, H. andChiang, F.P., “Photoelastic Determination of Stress Intensity Factor of an Interfacial Crack in a Bi-material,”J. Appl. Mech.,60,93–100 (1993).
Wang, W.C. andChen, J.T., “Theoretical and Experimental Re- examination of a Crack Perpendicular to and Terminating at the Bimaterial Interface,”J. Strain Anal.,28,58–61 (1993).
Tippur, H.V. andRosakis, A.J., “Quasi-static and Dynamic Crack Growth along Bimaterial Interfaces: A Note on Crack-tip Field Measurements Using Coherent Gradient Sensing,” EXPERIMENTAL MECHANICS,31,243–251 (1991).
Theocaris, P.S. andMillos, J., “Dynamic Crack Propagation in Composites,”Int. J. Fract.,16,31–51 (1980).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Meguid, S.A., Tan, M.A. Photoelastic analysis of the singular stress field in a bimaterial wedge. Experimental Mechanics 40, 68–74 (2000). https://doi.org/10.1007/BF02327550
Received:
Revised:
Issue Date:
DOI: https://doi.org/10.1007/BF02327550