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Bonded resistance strain gages

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Suggested List of Reading References

  1. Murray, W. M., and Stein, P. K., Strain Gage Technique (available through SESA).

  2. Perry, C. C., and Lissner, H. R., The Strain Gage Primer, McGraw-Hill (1962).

  3. Dean, M., Semiconductor and Conventional Strain Gages, Academic Press (1962).

  4. Symposium On Elevated Temperature Strain Gages, ASTM Special Publication No. 230.

  5. Bloss, R. L., Evaluation of Resistance Strain Gages At Elevated Temperatures (Series of Technical Reports Printed By National Bureau of Standards).

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Authors and Affiliations

  1. Semiconductor Strain Devices, BLH Electronics, Baldwin-Lima-Hamilton Corp., Waltham, Mass.

    L. J. Weymouth (Section Head) & J. E. Starr (Product Manager)

  2. Micro-Measurements, Inc., Romulus, Mich

    J. Dorsey (Product Manager)

Authors
  1. L. J. Weymouth
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  2. J. E. Starr
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  3. J. Dorsey
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Weymouth, L.J., Starr, J.E. & Dorsey, J. Bonded resistance strain gages. Experimental Mechanics 6, 19A–30A (1966). https://doi.org/10.1007/BF02326153

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  • DOI: https://doi.org/10.1007/BF02326153

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