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Microfocus X-ray mapping of fatigue processes in single-crystal copper

Paper investigates the effects of fatigue of notched specimens at nominal stress levels considerably below the endurance limit, as well as the adaptability of a microfocus X-ray mapping technique to the study of the damage process

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Abstract

A series of fatigue tests in tension were performed on symmetrically notched, single-crystal, copper specimens. A microfocus X-ray mapping technique is described and used to map the distortion in the crystal after various cycles of stressing. Two stages in the fatigue process were monitored simultaneously: (1) the progress of a general type of distortion, and (2) the breaking up of the crystal into small crystallites of almost identical orientation. The observations are related to dislocation formation and pileup.

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Wayson, A.R. Microfocus X-ray mapping of fatigue processes in single-crystal copper. Experimental Mechanics 8, 369–374 (1968). https://doi.org/10.1007/BF02326041

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  • DOI: https://doi.org/10.1007/BF02326041

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