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Material properties in thermal-stress analysis

Photoelastic materials are evaluated on their application to a transient-thermal-stress analysis

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Abstract

With simple techniques and not too-costly laboratory equipment, the significant material properties in modeling transient thermal stresses by photothermoelasticity are evaluated. The results are presented for a room-temperature-cured epoxy, a hot-cured epoxy and a polycarbonate. The materials tested are also evaluated on their applicability to a transient-thermal-stress analysis.

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Abbreviations

A :

area

α:

coefficient of thermal expansion

β:

thermal diffusivity,kC p

C p :

specific heat

E :

Young's modulus

∈:

strain

f o :

photoelastic-fringe coefficient

h :

beam thickness or plate thickness

I :

area moment of inertia

k :

thermal conductivity

λ:

wavelength of light

l′ :

length

ν:

Poisson's ratio

M :

bending moment

m :

mass

N :

photoelastic-fringe number

P :

load

Q t :

figure of merit,Eα/f σ

R :

electrical resistance

ϱ:

mass density

σ:

principal stress

ΔT :

temperature difference

V :

voltage

y :

distance from neutral axis of a beam

References

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  2. Burger, C.P., “Thermal Modeling,”Experimental Mechanics 15 (11),430–441 (1975).

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  3. Burger, C.P., “A Generalized Method for Photoelastic Studies of Transient Thermal Stresses,”Experimental Mechanics,9 (12),529–537 (1969).

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  4. Tsuji, M. andOda, M., “Investigation of Photothermoelasticity by Means of Heating,”J. of Thermal Stresses,2,215–232 (1979).

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  5. Marloff, R.H., “Thermal Tests of a Steam-turbine Nozzle-chamber Model,”Experimental Mechanics,19 (11),399–405 (1979).

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  6. ASTM Standards, Part 3, 1084 (1955).

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Miskioglu, I., Gryzagorides, J. & Burger, C.P. Material properties in thermal-stress analysis. Experimental Mechanics 21, 295–301 (1981). https://doi.org/10.1007/BF02325769

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  • DOI: https://doi.org/10.1007/BF02325769

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