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Thermal bending associated with heat conduction by holographic interferometry

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Abstract

An experimental technique using real-time holographic interferometry combined with digitized image processing has been developed to measure the thermal diffusivity of polymers. This technique uses a cantilever beam or an annular disk with one side subjected to a pulse of radiant energy from a photographic flash. The resulting thermally induced deflection is measured by holographic interferometry. The observed deflection is due to a resultant thermal moment induced by a temperature gradient through the thickness. As time goes on, the heat conducts from the exposed surface through the thickness, resulting in a decrease of the bending moment and transverse deflection. It is shown that the deflection is proportional to the thermal moment, and the thermal diffusivity can be retrieved by moment analysis without deriving the analytical solution to the thermomechanical problem.

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Jou, C.S., Farris, R.J. Thermal bending associated with heat conduction by holographic interferometry. Experimental Mechanics 34, 306–314 (1994). https://doi.org/10.1007/BF02325145

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  • DOI: https://doi.org/10.1007/BF02325145

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