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Estimation of thermal stresses in the region with an eccentric hole by means of an analogy

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Abstract

The analogy used to solve some thermoelastic problems is extended to include a region with an eccentric hole. The relation is shown to be a little more complicated in this case than in the one for the concentric hole. Three bending tests of an analogous thin plate are required. As an experimental proof, an eccentric circular region is considered and mental proof, an eccentric circular region is considered and the analogous thin plate is prepared. The heat-conduction equation is first solved to give the required temperature terms. The measured strains on the plate and the coefficients specified from the transverse loads and moments applied to the plate are combined effectively to get the estimated thermal stress. The experimentally estimated thermal stress of the region and the numerical result are shown to be in agreement.

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References

  1. Hetényi, M., Handbook of Experimental Stress Analysis, John Wiley & Sons, 775–789 (1957).

  2. Sumi, S., Matsumoto, E. and Sekiya, T., “Analysis of Unsteady Thermal Stress in Hollow Circular Region by Mechanical Analogy,” Proc. 15th Japan Nat. Cong. for Appl. Mech., 21–26 (1965).

  3. Matsumoto, E. andSekiya, T., “Analogue Solution of Two-dimensional Thermoelastic Problems with Internal Heat Generation and Heat Transfer,”Experimental Mechanics,21 (9),355–360 (Sept.1981).

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  4. Durelli, A.J. andBarriage, J., “Application of a New Deformeter to Two-Dimensional Thermal Stress Problems,”Proc. SESA,XIII (2),97–106 (1956).

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  5. Wang, Y.C., Matsumoto, E. and Tanaka, K., “Some Solutions of Heat Conduction and Thermoelastic Problems,” Proc. Int. Conf. Education, Practice and Promotion of Computation Methods in Engineering Using Small Computers (Aug. 1985).

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Authors and Affiliations

  1. University of Osaka Prefecture, 591, Sakai, Osaka, Japan

    E. Matsumoto (SEM Member) is Associate Professor)

  2. Shanghai Jao Tong University, Shanghai, People's Republic of China

    T. Sekiya (Professor) & Y. C. Wang (Lecturer)

  3. University of Osaka Prefecture, 591, Sakai, Osaka, Japan

    K. Kawauchi (Graduate Student)

Authors
  1. E. Matsumoto
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  2. T. Sekiya
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  3. Y. C. Wang
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  4. K. Kawauchi
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Matsumoto, E., Sekiya, T., Wang, Y.C. et al. Estimation of thermal stresses in the region with an eccentric hole by means of an analogy. Experimental Mechanics 25, 251–254 (1985). https://doi.org/10.1007/BF02325094

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  • DOI: https://doi.org/10.1007/BF02325094

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