Abstract
Although peel stresses are believed to be responsible for failure in many adhesive joint geometries, the measurement of these peel stresses has been elusive. In this work, embedded poly(vinylidene fluoride) piezoelectric sensors were used to measure peel stresses in adhesively bonded joints. Piezoelectric KYNAR® film was etched to produce multi-area stress sensors which were bonded into adhesive joints. Calibration results and results for single-lap and elastomeric butt joints are presented. The elastomeric butt joint was compared to an analytical solution for the bond-normal stresses, and the single-lap joint results were compared to finite-element analysis. Promising features and liminations of this technique are discussed.
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Anderson, G.L., Robertson, R.C., Peterson, B.L. et al. Embedded piezoelectric sensors to measure peel stresses in adhesive joints. Experimental Mechanics 34, 194–201 (1994). https://doi.org/10.1007/BF02319755
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DOI: https://doi.org/10.1007/BF02319755