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Mössbauer study of interphase formation at the interface of electrodeposited tin on nickel or aluminium

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Abstract

Besides β-Sn, a Ni−Sn alloy was identified by means of Mössbauer investigations on tin plated nickel foils formed during the electrodeposition of119Sn on nickel substrate. The average thickness of the layer caused by electroimplantation is about 80 to 100 nm on each side of the sample. The amount of the Ni−Sn alloy increases by heat treatment and the activation energy of the interdiffusion Q=102.5±2 kJ/mol was determined. A diffusion into the substrate could not be observed for electrodeposited119Sn on aluminium even at temperatures above the melting point of tin.

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Authors and Affiliations

  1. Central Institute of Physical Chemistry, Academy of Sciences of the GDR, DDR-1199, Berlin-Adlershof, (GDR)

    H. Mehner

  2. Laboratory of Nuclear Chemistry, L. Eötvös University, H-1088, Budapest, (Hungary)

    A. Vértes

Authors
  1. H. Mehner
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  2. A. Vértes
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Mehner, H., Vértes, A. Mössbauer study of interphase formation at the interface of electrodeposited tin on nickel or aluminium. Journal of Radioanalytical and Nuclear Chemistry, Articles 89, 153–160 (1985). https://doi.org/10.1007/BF02070212

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  • DOI: https://doi.org/10.1007/BF02070212

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