Abstract
Numerical simulation is used to analyze the operation of a semiconductor tin-monosulfide thermocouple. The element is used to record exothermic processes in shock-recovery experiments. We solved the problem in a one-dimensional formulation by considering a multilayer scheme that models the location of the sample and the thermocouple inside a real flat capsule. Numerical calculations yield time dependences of the thermal electromotive force(EMF) at various heat-release rates in the substance under study.
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Translated from Fizika Goreniya i Vzryva, Vol. 32, No. 4, pp. 120–127, July–August, 1996.
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Nabatov, S.S., Kul'bachevskii, A.V. & Lebedev, A.V. Numerical analysis of semiconductor thermocouple operation in recording exothermic processes in a recovery capsule. Combust Explos Shock Waves 32, 460–465 (1996). https://doi.org/10.1007/BF01998500
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DOI: https://doi.org/10.1007/BF01998500