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Application of thermal analysis to study the causes of disintegration in insulating systems

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Abstract

In the procduction of high-voltage insulating systems, disintegration and non-homogeneity occur in some cases and these factors can lead to the deterioration and even the breakdown such systems. In research into the causes of these phenomena DTA and TG were applied to study the course of hardening of the systems and to quantify the leaking substances. The results demonstrate the great value of thermal analysis in this field.

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Authors and Affiliations

  1. Department of Electrotechnology, Institute of Electrical Machines, Technical University, Pilsen, C.S.F.R.

    E. Kucerová & V. Mentlík

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  1. E. Kucerová
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  2. V. Mentlík
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Kucerová, E., Mentlík, V. Application of thermal analysis to study the causes of disintegration in insulating systems. Journal of Thermal Analysis 37, 2427–2430 (1991). https://doi.org/10.1007/BF01913745

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  • DOI: https://doi.org/10.1007/BF01913745

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