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Interdiffusion in the copper-rich solid solutions of Cu-Ga and Cu-Mg alloys

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Niihama National College of Technology, 7-1 Yagumo, 792, Niihama, Japan

    T. Takahashi

  2. Department of Materials Science and Engineering, Faculty of Engineering, Osaka University, 2-1 Yamadaoka, 565, Suita, Osaka, Japan

    T. Yamane, Y. Minamino & T. Kimura

Authors
  1. T. Takahashi
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  2. T. Yamane
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  3. Y. Minamino
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  4. T. Kimura
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Takahashi, T., Yamane, T., Minamino, Y. et al. Interdiffusion in the copper-rich solid solutions of Cu-Ga and Cu-Mg alloys. J Mater Sci Lett 8, 882–884 (1989). https://doi.org/10.1007/BF01729933

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  • DOI: https://doi.org/10.1007/BF01729933

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