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Microstructural refinement of a copper-base age-hardenable alloy through thermomechanical processing

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Journal of Materials Science Letters

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References

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Authors and Affiliations

  1. METCON, 2170 Aquinas Avenue, 91711, Claremont, California, USA

    P. K. Sengupta

  2. Department of Quality Control, Israel Electric Works, Haifa, Israel

    J. Rezek

Authors
  1. P. K. Sengupta
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  2. J. Rezek
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Sengupta, P.K., Rezek, J. Microstructural refinement of a copper-base age-hardenable alloy through thermomechanical processing. J Mater Sci Lett 5, 445–449 (1986). https://doi.org/10.1007/BF01672357

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  • DOI: https://doi.org/10.1007/BF01672357

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