Microstructure of aluminium-copper thin films and its relation to electromigration

Abstract

The microstructure of polycrystalline aluminium — 7·6 wt % copper thin films evaporated from the starting Al-Cu alloy was studied using electron microscopy and microanalysis. The structural properties of films were confronted with electromigration lifetime measurements of Al-Cu thin film conductors. In the films Al₂Cu precipitates were observed. Thermodynamically stable Θ-Al₂Cu precipitates were found at grain boundaries, triple points and on the film surface. Within the grains Θ′-Al₂Cu precipitates were detected. When the temperature of deposition and/or the time of annealing of the films at 480 °C in nitrogen increased, the growth of grains and of the total volume of the precipitate phase was observed. Under these conditions precipitates tended to grow preferentially at the film surface and they ceased to influence the grain size distribution. The distribution approached then the log-normal distribution function. With regard to the structural investigations it is anticipated that the best electromigration resistance among the studied samples should possess conductors deposited at 250 °C as well as conductors deposited at 150 °C and 250 °C and annealed 10 min at 480 °C. The lifetimes of conductors having this type of microstructure and tested at the current density of 3×10⁶ A/cm² had values of 210÷3500 hrs, corresponding to the testing temperature of 150 °C. Higher lifetimes were observed with wider (20 μm) and shortest (120 μm) conductors encapsulated in packages filled with nitrogen. The activation energy for the failure process was 0·65 eV in this case.