Abstract
The electrical properties of the SiO2/n-type Si(100) interface, where the silicon-oxide layer was grown by an electrodeless rf oxygen-plasma-cathodization technique, were investigated usingC-V and DLTS methods. Interface traps with high density in the range of 1012 eV−1 cm−2 and a capture cross section as large as 10−18 cm2 were found in the upper region of the silicon forbidden gap. After a post-annealing process, typically at 400°C for 30 min in dry N2 atmosphere, their densities and capture cross sections were reduced to the range of 1–2 × 1011 eV−1 cm−2 and 10−19 cm−2, respectively. Apparant differences in DLTS curves before and after thermal annealing were also observed. Results are qualitatively explained by considering the specific oxidation and annealing mechanism of this low-temperature silicon-oxidation technique.
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Liang, Z.X., Han, Z.S., Loua, J.S. et al. Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface. Appl. Phys. A 62, 391–395 (1996). https://doi.org/10.1007/BF01594239
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DOI: https://doi.org/10.1007/BF01594239