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Machining of submicron structures on metals and semiconductors by ultrashort UV-laser pulses

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Abstract

Ablation of submicron structures on copper and silicon by short ultraviolet laser pulses (0.5–50 ps, 248 nm) is presented. Features like periodic line structures with a line-spacing below 400 nm, and holes with characteristic sizes well below 1 µm are produced on the sample surface by single laser shot exposure. The structures are projection printed by a Schwarzschild-objective (N.A.=0.4) in air environment. The morphology of ablation sites made with different pulse durations (0.5 ps, 5 ps, 50 ps) is discussed in terms of thermal diffusion effects.

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  1. Laser-Laboratorium Göttingen e.V., Hans-Adolf-Krebs-Weg 1, D-37077, Göttingen, Germany

    P. Simon & J. Ihlemann

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  1. P. Simon
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  2. J. Ihlemann
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Simon, P., Ihlemann, J. Machining of submicron structures on metals and semiconductors by ultrashort UV-laser pulses. Appl. Phys. A 63, 505–508 (1996). https://doi.org/10.1007/BF01571681

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  • DOI: https://doi.org/10.1007/BF01571681

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